Production Capacity

ESP’s Contract Manufacturing Production Facilities

Electronic and Electromechanical Consignment (your parts) and
Full Turnkey (we do everything) Contract Manufacturing.
Capability for low, medium and higher volume mixed technology production with placement capacity to 60,000 CPH.
Automated optical inspection (AOI).
Component distributor inventory is available on site to speed delivery time control cost.
Customer jobs typically range in size from 50 to 2000 boards per due to our flexibility and various sized mix of production and test equipment. On the other hand we are capable of producing 20,000 boards/mo on a single production line. This means we can grow with you and remain cost competitive through the entire product life cycle.
With 42,000 sq.ft. we can serve your largest needs.

Capabilities

Surface Mount Technology (SMT)
Through Hole Circuit Boards (PTH)
Mixed Technology PCB
Functional Testing
Automated Optical Inspection – Inline
Box Build; Full Assemblies
Design for Manufacturability (DFM)
Full Project Management
Engineering Design
IPC CLASS II and CLASS III certified
ISO 9002 pending
BGAs and CCGAs
Micro and Fine Pitch BGAs
SMT 24″ x 30″for press fit Backplanes
CGA’s to 1.0mm
PBGA’s, uBGA’s
CSP,s to 0.5mm
leaded parts to 0.3 mm
chips and discretes to 0402
chips and discretes to 0201 (pending-please inquire)
Automatic wave solder 18″ max board width x __ length
Selective soldering capabilities – no board size limitation
Full autopress capability for high density press fit connectors
(VHDM R and Zpack R)

ESP’s Remanufacturing & Repair Service

In the life cycle of certain high end electronic products, upgrades are required to assemble components. ESP performs removal and replacement of obsolete or defective components. Typical applications might include upgrading servers or replacing components in telecommunication equipment. Let us know what you need done.

Remanufacturing Services:

Depot Repair-Systems & PCBA
End-of-Life
Logistics and Distribution

System Integration