Printed Circuit Board Assembly (PCBA)
Electronic Service Provider Inc (ESP) specializes in the assembly of printed circuit boards (PCBA) and in electro-mechanical (ELM) assembly for original equipment manufacturers (OEM).
- surface-mount technology (SMT),
- pin through hole technology (THT/PTH),
- ball grid array (BGA)
- chip on board (COB)
- lead-free soldering
- conformal coating
- FR-4, flex circuits, rigid-flex and mixed technologies
- electro-mechanical and cable/harness assembly
- press fit connections
On the production side, we have 3 Surface Mount Technology (SMT) lines placing up to 60,000 components/hr., automated through-hole and the equipment capability prototype, low volume up to high volume production output. Our facilities are highly flexible.
Surface Mount and Mixed PCB technologies-ESP has expanded and modernized operations to include 3 Surface Mount Lines with capacity of 60,000 placemetns per hour. We have capability for both low and medium volume production mix. We provide consignment or turnkey. Component inventory is available on site to speed delivery time.
- BGA’s and CCGA’s
- Micro’s and Fine Pitch BGAs
- Automated Surface Mount
- Chip on Board (COB)
- Through Hole Assemblies (THT)
- Mixed Technology Assemblies
- Surface MountTechnology (SMT)
- Functional Testing
- Box Build
- Press Fit Compliance Pin Connections
- X-Ray Inspection
- Automated Optical Inspection (AOI)
Assembly line capability to handle early stage prototype development. To prove out a design, we can build rush prototype assemblies to specification in 4 to 12 hours. Prototype production up to 18,000 CPH for quick turns occupying a dedicated room to meet the client’s demands. Small production runs are also produced on this dedicated line. Our turnaround time is one of the fastest in the industry for prototype and low volume runs.
- Complete Documentation
- Electrical Design support
- Quick Turn PCB Design and Prototype
- Design for Manufacturability Assessment
- Mechanical Design and Prototyping
- Component Engineering (BOM Analysis and creation)
- ISO Compliant
ESP’s Dedicated Prototype Facility
With a dedicated Prototype room and line separate from our volume production lines, we offer a higher level of service and commitment to your new products. We can build your prototype (1-5) assemblies to specification in 4 to 12 hours to prove out a design.
Our turn around time is one of the fastest in the industry because our prototype equipment is dedicated and not part of our production lines. We even invite your engineers to work at our side if they wish.
ESP’s dedicated prototype program means we devote the time and attention to detail that your new product deserves.
Lead Free Soldering/Pb-Free
ESP now offers a proven LEAD FREE PBC ASSEMBLY process for SMT and Through-Hole Technology Assemblies. We offer RoHS compliant assemblies for both our domestic and overseas customers.
- Lead Free Soldering
- Lead Free Circuit Board Assembly
- Lead Free Rework
- Lead Free PCB
ESP now offers a robust Lead free assembly process for Surface Mount Technology (SMT) and Through-Hole Technology (THT/PTH) Assemblies. We offer RoHS compliant assemblies for both our domestic and overseas customers.
Making the Lead Free Transition
The transition to Lead Free will impact most aspects of manufacturing operations. We support customers through the challenging transition. ESP has the engineering, processes and capabilities to make your transition go smoothly and for you to quickly deliver lead-free products to market.
The ESP Offering Includes:
- Design Review
- BOM analysis
- RoHS Sourcing
- RoHS Manufacturing
- Material Declaration Sheets
- Lead-Free Assembly
- Assured Lead-Free Quality
Worldwide Compliance to New Environmental Standards
- Lead Free
Lead-Free Process Validation
Complete visual and micro-structural analysis were conducted at ESP to verify the micro-structural integrity of Electronic Service Provider’s PCB assemblies and ensures that each of the solder connections made by ESP meet IPC Standards Class III
New and Rework Lead-Free PCB Assemblies
Successful rework and assembly methods have been developed with lead-free solders for all types of components. Successful manufacturing and rework methods have been developed with lead-free solders (including Sn/Ag/Cu or Sn/Ag alloys) including components removal/replacement, jumper wires, trace and pad repairs and BGAs. The soldering parameters are adjusted to accommodate the higher melting temperature and lower wetability of the lead-free solder. We have developed practices and processes that deal with the issues related to handling, reworking, tracking and inspecting lead free PCB assemblies.
Our process studies have shown that reliable lead-free solder joints, with proper grain structures and inter-metallic formation, can be produced using appropriate manufacturing and rework processes utilized by Electronic Service Provider. Please give us a call so we can help.
Lead Free rework including BGA reballing, removal and replacement services.
We specialize in the assembly of printed circuit boards (PCBA) and in electromechanical (ELM) assembly for original equipment manufacturers (OEMs).
PCB SMT, PTH, BGA, COB, and Lead-Free Assembly
- State of the art manufacturing techniques
- Fine Pitch Interconnect Technology
- DIP, SIP, VCD, Radial, and ZIP Package Insertion
- 0402 (EIAJ1005) and other passives
- High Velocity System Assembly
- Complex System Assembly and Configuration Management
- Order Entry, Configuration, Fulfillment Services
- System Prototype Assembly
Electronic and Electromechanical Printed Circuit Board Assembly
Full Service – Components, Assemblies and Sub-Assemblies
Our assembly facilities can be configured to offer the maximum in flexibility. Whether you need us to build a few simple boards or 1000 electromechanical medical devices containing the latest in microfluidics or robotics we will be able to accommodate your needs. We do this by quickly modifying up to 25,000 sq. ft. of open space dedicated to assembly of large and small equipment.
Much of our assembly equipment – work stations, work benches and test equipment is highly portable so it is quick and easy to reconfigure as assembly configuration needs change.